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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/24/2015
Application #:
12489881
Filing Dt:
06/23/2009
Publication #:
Pub Dt:
06/24/2010
Inventors:
Jae Jun LEE, Mahn Jong KIM, Kwang Hee KIM
Title:
THERMOSETTING OLIGOMER OR POLYMER, THERMOSETTING RESIN COMPOSITION INCLUDING THE OLIGOMER OR POLYMER, AND PRINTED CIRCUIT BOARD USING THE COMPOSITION
Assignment: 1
Reel/Frame:
022957/0451Recorded: 07/15/2009Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/12/2009
Exec Dt:
06/12/2009
Exec Dt:
06/12/2009
Assignees:
416, MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
190 YEOCHON-DONG, NAM-GU
ULSAN, KOREA, REPUBLIC OF 680-090
Correspondent:
CANTOR COLBURN LLP
20 CHURCH STREET, 22ND FLOOR
HARTFORD, CT 06103
Assignment: 2
Reel/Frame:
033025/0222Recorded: 06/04/2014Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/29/2014
Exec Dt:
04/18/2014
Assignee:
314, MAETAN-3DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-803
Correspondent:
CANTOR COLBURN LLP
20 CHURCH STREET
22ND FLOOR
HARTFORD, CT 06103

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