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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/31/2015
Application #:
13241925
Filing Dt:
09/23/2011
Publication #:
Pub Dt:
03/29/2012
Inventors:
Haiwei SUN, Jia LIU, Site CAI
Title:
LIGHT EMITTING DIODE PACKAGE UNIT, METHOD FOR MANUFACTURING THE SAME AND BACKLIGHT
Assignment: 1
Reel/Frame:
026966/0264Recorded: 09/26/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/25/2011
Exec Dt:
08/25/2011
Exec Dt:
08/25/2011
Assignee:
NO. 8 XIHUANZHONGLU, BDA
BEIJING, CHINA 100176
Correspondent:
RICHARD J. STREIT
LADAS & PARRY, 224 SOUTH MICHIGAN AVE.
CHICAGO, IL 60604

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