Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/31/2015
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Application #:
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13775178
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Filing Dt:
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02/23/2013
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Publication #:
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Pub Dt:
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07/25/2013
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Inventors:
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Heui-Gyun AHN, Se-Jung OH, In-Gyun JEON, Jun-Ho WON
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Title:
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METHOD FOR FORMING PAD IN WAFER WITH THREE-DIMENSIONAL STACKING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 19F, DAECHI TOWER B/D, #891, DAECHI-DONG, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| KILE PARK REED & HOUTTEMAN PLLC |
| 1200 NEW HAMPSHIRE AVE. NW |
| SUITE 570 |
| WASHINGTON, DC 20036 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 19F, DAECHI TOWER B/D, #891, DAECHI-DONG, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| KILE PARK REED & HOUTTEMAN PLLC |
| 1101 30TH STREET, NW |
| SUITE 500 |
| WASHINGTON, DC 20007 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| IP&T GROUP LLP |
| 8230 LEESBURG PIKE SUITE 650 |
| VIENNA, VA 22182 |
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