Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/31/2015
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Application #:
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13833036
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Filing Dt:
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03/15/2013
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Publication #:
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Pub Dt:
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09/26/2013
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Inventors:
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Akihiko Tateiwa, Masato Tanaka, Akio Rokugawa
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING A METAL PLATE, SEMICONDUCTOR CHIP, AND WIRING STRUCTURE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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80, OSHIMADA-MACHI |
NAGANO-SHI, NAGANO, JAPAN 381-2287 |
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RANKIN HILL AND CLARK LLP |
38210 GLENN AVENUE |
WILLOUGHBY, OH 44094 |
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