Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/07/2015
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Application #:
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12738646
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Filing Dt:
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04/19/2010
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Publication #:
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Pub Dt:
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10/21/2010
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Inventor:
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Tetsuro Nishimura
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Title:
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SOLDER JOINT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 16-15, ESAKA-CHO 1-CHOME |
| SUITA-SHI, OSAKA, JAPAN 5640063 |
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| JOHN F. KANE, ESQ. |
| P.O. BOX 8801 |
| DAYTON, OH 45401-8801 |
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