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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
04/07/2015
Application #:
13322080
Filing Dt:
02/16/2012
Publication #:
Pub Dt:
06/07/2012
Inventors:
Takeshi Senda, Hiromichi Isogai, Eiji Toyoda, Koji Araki, Tatsuhiko Aoki, Haruo Sudo et al
Title:
SILICON WAFER AND METHOD FOR HEAT-TREATING SILICON WAFER
Assignment: 1
Reel/Frame:
027718/0789Recorded: 02/16/2012Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/03/2012
Exec Dt:
01/20/2012
Exec Dt:
12/22/2011
Exec Dt:
02/06/2012
Exec Dt:
02/03/2012
Exec Dt:
02/03/2012
Exec Dt:
02/05/2012
Exec Dt:
02/03/2012
Exec Dt:
01/31/2012
Exec Dt:
02/13/2012
Assignee:
6-3, OHSAKI 1-CHOME
SHINAGAWA-KU, TOKYO, JAPAN
Correspondent:
BUCHANAN INGERSOLL & ROONEY P.C.
P.O. BOX 1404
ALEXANDRIA, VA 22313-1404
Assignment: 2
Reel/Frame:
029962/0497Recorded: 03/11/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/26/2012
Assignee:
6-861-5, SEIRO-MACHI HIGASHIKO
KITAKANBARA-GUN
NIIGATA, JAPAN 957-0197
Correspondent:
ROBERT G. MUKAI
1737 KING STREET
SUITE 500
ALEXANDRIA, VA 22314
Assignment: 3
Reel/Frame:
029991/0421Recorded: 03/13/2013Pages: 15
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/07/2013
Assignee:
6-861-5, SEIRO-MACHI HIGASHIKO
KITAKANBARA-GUN
NIIGATA, JAPAN 957-0197
Correspondent:
BUCHANAN INGERSOLL & ROONEY PC
1737 KING STREET
SUITE 500
ALEXANDRIA, VA 22314

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