Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/28/2015
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Application #:
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13527751
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Filing Dt:
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06/20/2012
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Publication #:
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Pub Dt:
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02/28/2013
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Inventors:
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Tetsuo IMAI, Emi USHIODA
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Title:
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PLATING METHOD OF CIRCUIT SUBSTRATE, PRODUCTION METHOD OF PLATED CIRCUIT SUBSTRATE, AND SILVER ETCHING LIQUID
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, MIKAGE-CHO, |
| SHUNAN-SHI, YAMAGUCHI, JAPAN 745-8648 |
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| RICHARD J. STREIT |
| LADAS & PARRY, 224 SOUTH MICHIGAN AVE. |
| CHICAGO, IL 60604 |
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