Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/05/2015
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Application #:
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14166749
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Filing Dt:
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01/28/2014
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Publication #:
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Pub Dt:
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07/31/2014
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Inventors:
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Bai-Yao LOU, Chih-Hao CHEN, Shih-Kuang CHEN
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Title:
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WAFER PACKAGING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9F., NO. 23, JILIN RD. |
ZHONGLI CITY, TAOYUAN COUNTY, TAIWAN 320 |
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WEN LIU |
350 S. FIGUEROA STREET, SUITE 975 |
LOS ANGELES, CA 90071 |
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