Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/02/2015
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Application #:
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13331582
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Filing Dt:
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12/20/2011
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Publication #:
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Pub Dt:
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06/20/2013
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Inventors:
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Kuang Yang, Fang Liu
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Title:
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Method for Wafer-Level Surface Micromachining to Reduce Stiction
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE TECHNOLOGY WAY |
| NORWOOD, MASSACHUSETTS 02062-9106 |
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| THOMAS J. TUYTSCHAEVERS |
| SUNSTEIN KANN MURPHY & TIMBERS LLP |
| 125 SUMMER STREET |
| BOSTON, MA 02110-1618 |
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