Patent Assignment Abstract of Title
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Total Assignments:
5
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Patent #:
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Issue Dt:
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06/02/2015
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Application #:
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12709425
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Filing Dt:
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02/19/2010
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Publication #:
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Pub Dt:
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06/17/2010
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Inventors:
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Byung Tai Do, Heap Hoe Kuan
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING WAFER LEVEL CHIP SCALE PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| WONG & REES LLP |
| 4677 OLD IRONSIDES DRIVE |
| SUITE 370 |
| SANTA CLARA, CA 95054 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 39TH FLOOR, CITIBANK TOWER, CITIBANK PLAZA, 3 GARDEN ROAD |
| CENTRAL, HONG KONG |
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| MILBANK, TWEED, HADLEY & MCCLOY, LLP |
| 28 LIBERTY STREET |
| C/O LAWRENCE KASS |
| NEW YORK, NY 10005 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #04-08/09 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| WONG & REES LLP |
| 4677 OLD IRONSIDES DRIVE |
| SUITE 370 |
| SANTA CLARA, CA 95054 |
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Assignment:
4
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 46429 LANDING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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Assignment:
5
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CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE SECOND ASSIGNEE PREVIOUSLY RECORDED ON REEL 052972 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE DEED OF RELEASE.
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| 46429 LANDING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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