Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/16/2015
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Application #:
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13988555
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Filing Dt:
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05/21/2013
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Publication #:
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Pub Dt:
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09/19/2013
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Inventor:
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Kimiya Miyashita
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Title:
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CERAMIC HEAT SINK MATERIAL FOR PRESSURE CONTACT STRUCTURE AND SEMICONDUCTOR MODULE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-8001 |
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| 8, SHINSUGITA-CHO |
| ISOGO-KU |
| YOKOHAMA-SHI, KANAGAWA-KEN, JAPAN 235-0032 |
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| HARNESS, DICKEY & PIERCE, PLC |
| P. O. BOX 828 |
| MICHAEL E. HILTON, ESQ. |
| BLOOMFIELD HILLS, MI 48303 |
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