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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9070747
Issue Dt:
06/30/2015
Application #:
14039384
Filing Dt:
09/27/2013
Publication #:
20150001684
Pub Dt:
01/01/2015
Inventors:
Eugene A. Stout, Douglas M. Scott, Anthony P. Curtis, Theodore G. Tessier et al
Title:
ELECTROPLATING USING DIELECTRIC BRIDGES
Assignment: 1
Reel/Frame:
031358/0218Recorded: 10/07/2013Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
STOUT, EUGENE A.
Exec Dt:
10/03/2013
SCOTT, DOUGLAS M.
Exec Dt:
10/03/2013
CURTIS, ANTHONY P.
Exec Dt:
10/03/2013
TESSIER, THEODORE G.
Exec Dt:
10/03/2013
BURGESS, GUY F.
Exec Dt:
10/03/2013
Assignee:
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DR.
PHOENIX, ARIZONA 85034
Correspondent:
GREENBERG TRAURIG, LLP (PHX)
77 WEST WACKER DRIVE, SUITE 3100
C/O INTELLECTUAL PROPERTY DEPARTMENT
CHICAGO, IL 60601
Assignment: 2
Reel/Frame:
055213/0924Recorded: 02/04/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
FLIPCHIP INTERNATIONAL, LLC
Exec Dt:
01/11/2021
Assignee:
HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD.
112 LONGTENG ROAD, ECONOMIC & TECHNICAL DEVELOPMENT ZONE
KUNSHAN, JIANGSU, CHINA 215300
Correspondent:
GANG YU
ACIP INTERNATIONAL, INC. 419 10TH ST,
SF, CA 94103

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