Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/07/2015
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Application #:
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14147051
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Filing Dt:
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01/03/2014
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Publication #:
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Pub Dt:
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07/03/2014
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Inventors:
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Jun-Won HAN, Jae-Hyun KIM, Tae-Hoon KIM, Ho-Geun LEE, You-Jeong JEONG, Jung-Sik CHOI
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Title:
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WAFER SUPPORTING STRUCTURE, INTERMEDIATE STRUCTURE OF A SEMICONDUCTOR PACKAGE INCLUDING THE WAFER SUPPORTING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 120, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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| LEE & MORSE, P.C. |
| 3141 FAIRVIEW PARK DRIVE |
| SUITE 500 |
| FALLS CHURCH, VA 22042 |
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