Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/14/2015
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Application #:
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14285505
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Filing Dt:
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05/22/2014
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Publication #:
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Pub Dt:
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11/27/2014
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Inventors:
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Anand Chandrashekar, Joydeep Guha, Raashina Humayun, Hua Xiang
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Title:
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METHODS AND APPARATUSES FOR VOID-FREE TUNGSTEN FILL IN THREE-DIMENSIONAL SEMICONDUCTOR FEATURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4650 CUSHING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| WEAVER AUSTIN VILLENEUVE & SAMPSON |
| 555 12TH STREET |
| OAKLAND, CA 94607 |
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