Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/04/2015
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Application #:
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13588696
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Filing Dt:
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08/17/2012
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Publication #:
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Pub Dt:
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12/05/2013
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Inventors:
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Young Ghyu AHN, Sang Soo Park, Min Cheol Park, Se Hwa Jeong
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Title:
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LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, AND PACKING UNIT THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN 3-DONG, YEONGTONG-GU |
| SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF |
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| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005-3096 |
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