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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
9099454
Issue Dt:
08/04/2015
Application #:
13964153
Filing Dt:
08/12/2013
Publication #:
20150041967
Pub Dt:
02/12/2015
Inventors:
Ulrich Wachter, Veronika Huber, Thomas Kilger, Ralf Otremba, Bernd Stadler, Dominic Maier et al
Title:
MOLDED SEMICONDUCTOR PACKAGE WITH BACKSIDE DIE METALLIZATION
Assignment: 1
Reel/Frame:
032179/0430Recorded: 02/07/2014Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WACHTER, ULRICH
Exec Dt:
09/26/2013
HUBER, VERONIKA
Exec Dt:
09/24/2013
KILGER, THOMAS
Exec Dt:
09/23/2013
OTREMBA, RALF
Exec Dt:
09/23/2013
STADLER, BERND
Exec Dt:
09/24/2013
MAIER, DOMINIC
Exec Dt:
09/23/2013
SCHIESS, KLAUS
Exec Dt:
09/23/2013
SCHLOEGL, ANDREAS
Exec Dt:
09/20/2013
WAHL, UWE
Exec Dt:
02/07/2014
Assignee:
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
8000 REGENCY PARKWAY
SUITE 415
CARY, NC 27518

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