Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/18/2015
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Application #:
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14253868
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Filing Dt:
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04/16/2014
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Inventors:
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Yi-Chieh Wang, Tsung Chuan Whang
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Title:
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ASSEMBLY STRUCTURE FOR CONNECTING MULTIPLE DIES INTO A SYSTEM-IN-PACKAGE CHIP AND THE METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 10, LI-HSIN 6TH RD., HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| NO. 8, LI-HSIN 6TH RD., HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| MIN-LEE TENG |
| 7F-2, NO. 79, SEC.2, ROOSEVELT RD. |
| TAIPEI, TAIWAN |
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