Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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08/18/2015
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Application #:
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13666089
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Filing Dt:
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11/01/2012
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Publication #:
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Pub Dt:
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05/02/2013
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Inventor:
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Tim Mobley
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Title:
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LOW COST AND HIGH PERFORMANCE BONDING OF WAFER TO INTERPOSER & METHOD OF FORMING VIAS AND CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8950 N. ORACLE ROAD, STE. 100 |
| TUCSON, ARIZONA 85704 |
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| QUAN NGUYEN |
| 4199 CAMPUS DRIVE, SUITE 550 |
| IRVINE, CA 92612 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8950 N. ORACLE RD. |
| SUITE 100 |
| ORO VALLEY, ARIZONA 85704 |
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| ROCHELLE ROTEA |
| 2440 W. EL CAMINO REAL |
| 6TH FLOOR |
| MOUNTAIN VIEW, CA 94040 |
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Assignment:
3
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CONDITIONAL ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
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| 5-1, MARUNOUCHI 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8405 |
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| OBLON, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
4
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 5-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN 100-8405 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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