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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9111972
Issue Dt:
08/18/2015
Application #:
10593282
Filing Dt:
04/22/2008
Publication #:
20080236488
Pub Dt:
10/02/2008
Inventors:
Mitsunori Takeshita, Tomoyuki Matsuda, Mitsuhiro Hirano, Akihiro Sato, Koji Shibata et al
Title:
Substrate Processing Apparatus and Manufacturing Method for a Semiconductor Device
Assignment: 1
Reel/Frame:
020857/0440Recorded: 04/25/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TAKESHITA, MITSUNORI
Exec Dt:
10/16/2006
MATSUDA, TOMOYUKI
Exec Dt:
10/16/2006
HIRANO, MITSUHIRO
Exec Dt:
10/16/2006
SATO, AKIHIRO
Exec Dt:
10/16/2006
MORITA, SHINYA
Exec Dt:
10/16/2006
MIYATA, TOSHIMITSU
Exec Dt:
10/23/2006
SHIBATA, KOJI
Exec Dt:
10/16/2006
Assignee:
HITACHI KOKUSAI ELECTRIC INC.
4-14-1 SOTOKANDA, CHIYODA-KU,
TOKYO, JAPAN 101-8980
Correspondent:
KRATZ, QUINTOS & HANSON, LLP.
1420 K STREET, N.W. SUITE 400
WASHINGTON, DC 20005
Assignment: 2
Reel/Frame:
048008/0206Recorded: 12/31/2018Pages: 23
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HITACHI KOKUSAI ELECTRIC INC.
Exec Dt:
12/05/2018
Assignee:
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO
CHIYODA-KU
TOKYO, JAPAN 101-0045
Correspondent:
VOLPE & KOENIG, P.C.
30 SOUTH 17TH STREET
SUITE 1800
PHILADELPHIA, PA 19103

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