Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/25/2015
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Application #:
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13870874
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Filing Dt:
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04/25/2013
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Publication #:
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Pub Dt:
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10/30/2014
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Inventors:
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Chong Zhang, Stefanie M. Lotz, Islam A. Salama
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Title:
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PACKAGE SUBSTRATE WITH HIGH DENSITY INTERCONNECT DESIGN TO CAPTURE CONDUCTIVE FEATURES ON EMBEDDED DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| SCHWABE, WILLIAMSON & WYATT, P.C. |
| 1211 SW 5TH AVENUE, SUITE 1900 |
| PORTLAND, OR 97204 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BLANCHARDSTOWN CORPORATE PARK 2 |
| PLAZA 255, SUITE 2A |
| DUBLIN, IRELAND D15 YH6H |
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| TAHOE RESEARCH, LTD. |
| BLANCHARDSTOWN CORPORATE PARK 2 |
| PLAZA 255, SUITE 2A |
| DUBLIN, D15 YH6H IRELAND |
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