Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/08/2015
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Application #:
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13321581
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Filing Dt:
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11/21/2011
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Publication #:
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Pub Dt:
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03/15/2012
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Inventors:
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Katsushi Miki, Yu Kita
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Title:
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HEAT-EXPANDABLE MICROSPHERES AND A METHOD OF MAKING HEAT-EXPANDABLE MICROSPHERES AND APPLICATION THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-3, SHIBUKAWA-CHO 2-CHOME, |
| YAO-SHI, OSAKA, JAPAN 581-0075 |
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| GLOBAL IP COUNSELORS, LLP |
| 1233 20TH STREET, NW, SUITE 700 |
| WASHINGTON, DC 20036-2680 |
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