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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/08/2015
Application #:
14235040
Filing Dt:
01/24/2014
Publication #:
Pub Dt:
07/10/2014
Inventor:
Shinichi Ishida
Title:
MODULE STRUCTURAL ANALYSIS SUPPORTING DEVICE AND PROGRAM
Assignment: 1
Reel/Frame:
032045/0357Recorded: 01/24/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/26/2013
Assignees:
102, SOGAKISHI
ODAWARA-SHI, KANAGAWA, JAPAN 250-0203
HIRAO JUTAKU 67-501
7-5, HIRAO 3-CHOME
INAGI-SHI, TOKYO, JAPAN 206-0823
8-13, KUDANMINAMI 4-CHOME
CHIYODA-KU, TOKYO, JAPAN 102-0074
Correspondent:
HOLTZ, HOLTZ, GOODMAN & CHICK PC
220 FIFTH AVENUE
16TH FLOOR
NEW YORK, NY 10001-7708

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