Patent Assignment Abstract of Title
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For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
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Patent #:
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Issue Dt:
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09/22/2015
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Application #:
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13994666
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Filing Dt:
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06/14/2013
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Publication #:
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Pub Dt:
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10/31/2013
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PCT #:
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US1158407
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Inventors:
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Mark T. Bohr, Christopher M. Pelto, Seshu V. Sattiraju, Kevin J. Lee, Andrew W. Yeoh et al
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Title:
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3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED WITH FINE PITCH BACKSIDE METAL REDISTRIBUTION LINES FABRICATED USING A DUAL DAMASCENE TYPE APPROACH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95052 |
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BLAKELY, SOKOLOFF, TAYLOR, & ZAFMAN LLP |
1279 OAKMEAD PARKWAY |
SUNNYVALE, CA 94085 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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BLANCHARDSTOWN CORPORATE PARK 2 |
PLAZA 255, SUITE 2A |
DUBLIN, IRELAND D15 YH6H |
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TAHOE RESEARCH, LTD. |
BLANCHARDSTOWN CORPORATE PARK 2 |
PLAZA 255, SUITE 2A |
DUBLIN, D15 YH6H IRELAND |
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