Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/22/2015
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Application #:
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14163569
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Filing Dt:
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01/24/2014
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Publication #:
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Pub Dt:
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07/31/2014
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Inventors:
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Yen-Hsin Chen, Yi-Chang Chang, Chi-Chih Shen
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Title:
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CHIP PACKAGE WITH IMPROVED HEAT DISSIPATION AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5F, NO. 5, INNOVATION ROAD I |
| HSINCHU SCIENCE PARK |
| HSIN-CHU, TAIWAN |
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| TUNG & ASSOCIATES / RANDY W. TUNG, ESQ. |
| 838 W. LONG LAKE RD. |
| SUITE 120 |
| BLOOMFIELD HILLS, MI 48302 |
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