Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/22/2015
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Application #:
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13993188
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Filing Dt:
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06/11/2013
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Publication #:
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Pub Dt:
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10/10/2013
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Inventor:
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Yatsuharu Yokota
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Title:
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REFLOW SOLDERING APPARATUS AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 437-11, NIBUKATAMACHI |
| HACHIOJI-SHI |
| TOKYO, JAPAN 1930822 |
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| ANDRUS, SCEALES, STARKE & SAWALL, LLP |
| 100 E. WISCONSIN AVE. |
| SUITE 1100 |
| MILWAUKEE, WI 53202 |
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