Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/29/2015
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Application #:
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13133967
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Filing Dt:
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06/10/2011
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Publication #:
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Pub Dt:
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10/06/2011
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Inventors:
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Reiner Anton, Brigritte Heinecke, Michael Ott, Christian Ressel
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Title:
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Mould for soldering, arrangement of moulds, a method and a component
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| WITTELSBACHERPLATZ 2 |
| MUNICH, GERMANY 80333 |
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| SANDRA BAKER |
| SIEMENS CORP - IP DEPT |
| 170 WOOD AVENUE SOUTH |
| ISELIN, NJ 08830 |
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