Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/29/2015
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Application #:
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13824479
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Filing Dt:
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03/18/2013
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Publication #:
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Pub Dt:
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07/11/2013
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Inventors:
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Nozomu Nishimura, Nobuhiro Mikami
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Title:
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COMPONENT BUILT-IN MODULE, ELECTRONIC DEVICE INCLUDING SAME, AND METHOD FOR MANUFACTURING COMPONENT BUILT-IN MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| NEC INTELLECTUAL PROPERTY CENTER AMERICA |
| 2100 PENNSYLVANIA AVE, NW |
| SUITE 560 |
| WASHINGTON, DC 20037-3213 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 979 KING'S ROAD |
| 23RD FLOOR, LINCOLN HOUSE, TAIKOO PLACE |
| QUARRY BAY, HONG KONG |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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