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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/06/2015
Application #:
13283078
Filing Dt:
10/27/2011
Publication #:
Pub Dt:
05/02/2013
Inventor:
Hongbin Bei
Title:
Multi-Component Solid Solution Alloys having High Mixing Entropy
Assignment: 1
Reel/Frame:
027381/0229Recorded: 12/14/2011Pages: 2
Conveyance:
CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/08/2011
Assignee:
1000 INDEPENDENCE AVE., SW
WASHINGTON, DISTRICT OF COLUMBIA 20585
Correspondent:
BRENDA K. BANKS
1000 INDEPENDENCE AVE.
WASHINGTON, DC 20585
Assignment: 2
Reel/Frame:
027137/0301Recorded: 10/28/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/27/2011
Assignee:
ONE BETHEL VALLEY ROAD
4500N, MS-6258
OAK RIDGE, TENNESSEE 37831-6258
Correspondent:
JOSEPH A. MARASCO
ONE BETHEL VALLEY ROAD
4500N, MS-6258
OAK RIDGE, TN 37831-6258

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