Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
10/13/2015
|
Application #:
|
14071352
|
Filing Dt:
|
11/04/2013
|
|
Publication #:
|
|
Pub Dt:
|
05/07/2015
| | | | |
|
Inventors:
|
Shih-Ming Chang, Chih-Ming Lai, Hung-Chang Hsieh
|
|
Title:
|
Method and System for Repairing Wafer Defects
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
|
|
|
|
| HAYNES AND BOONE, LLP IP SECTION |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
|
|
Search Results as of:
05/15/2024 04:20 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
