Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/20/2015
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Application #:
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14287343
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Filing Dt:
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05/27/2014
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Publication #:
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Pub Dt:
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12/11/2014
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Inventors:
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PIERRE BAR, Simon GOUSSEAU, Yann BEILLIARD
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Title:
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PROCESS FOR PRODUCING AT LEAST ONE THROUGH-SILICON VIA WITH IMPROVED HEAT DISSIPATION, AND CORRESPONDING THREE-DIMENSIONAL INTEGRATED STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 29, BOULEVARD ROMAIN ROLLAND |
| MONTROUGE, FRANCE F-92120 |
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| 850, RUE JEAN MONNET |
| CROLLES, FRANCE F-38926 |
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| CHRISTOPHER F. REGAN |
| 255 S. ORANGE AVENUE, SUITE 1401 |
| ORLANDO, FL 32801 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DU CHAMP-DES-FILLES 39 |
| 1228 PLAN-LES-OUATES |
| GENEVA, SWITZERLAND |
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| STMICROELECTRONICS, INC. |
| 750 CANYON DRIVE |
| SUITE 300 |
| COPPELL, TX 75019 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DU CHAMP-DES-FILLES 39 |
| 1228 PLAN-LES-OUATES |
| GENEVA, SWITZERLAND |
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| STMICROELECTRONICS, INC. |
| 750 CANYON DRIVE |
| SUITE 300 |
| COPPELL, TX 75019 |
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