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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9169576
Issue Dt:
10/27/2015
Application #:
13907433
Filing Dt:
05/31/2013
Publication #:
20130319867
Pub Dt:
12/05/2013
Inventors:
Makoto SAKAI, Toshiyuki MORINAGA, Mutsuko SAITO, Yoko MIZUNO, Shinjiro HAYASHI
Title:
ELECTROLYTIC COPPER PLATING SOLUTION AND METHOD OF ELECTROLYTIC COPPER PLATING
Assignment: 1
Reel/Frame:
036632/0939Recorded: 09/23/2015Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SAITO, MUTSUKO
Exec Dt:
05/15/2012
SAKAI, MAKOTO
Exec Dt:
05/15/2012
MIZUNO, YOKO
Exec Dt:
05/16/2012
MORINAGA, TOSHIYUKI
Exec Dt:
05/18/2012
HAYASHI, SHINJIRO
Exec Dt:
05/15/2012
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS K.K.
TENNOZ CENTRAL TOWER 2-2-24 HIGSHI SHINAGAWA
SHINAGAWAKU
TOKYO, JAPAN
Correspondent:
BARB STIEVE
2040 DOW CENTER
MIDLAND, MI 48674
Assignment: 2
Reel/Frame:
036633/0043Recorded: 09/23/2015Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
ROHM AND HAAS ELECTRONIC MATERIALS K.K.
Exec Dt:
06/11/2012
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
455 FOREST STREET
MARLBOROUGH, MASSACHUSETTS 01752
Correspondent:
BARB STIEVE
2040 DOW CENTER
MIDLAND, MI 48674

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