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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/03/2015
Application #:
14276481
Filing Dt:
05/13/2014
Publication #:
Pub Dt:
11/20/2014
Inventor:
Wenqi Zhang
Title:
Techniques for Fabricating Fine-Pitch Micro-Bumps
Assignment: 1
Reel/Frame:
032880/0966Recorded: 05/13/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/06/2014
Assignee:
200 LINGHU BLVD, BLDG 1
CHINA SENSOR NETWORK INT'L INNOVATION PARK
WUXI, JIANGSU, CHINA 214135
Correspondent:
GOODWIN PROCTER LLP
901 NEW YORK AVENUE N2
WASHINGTON, DC 20001

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