Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/03/2015
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Application #:
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14553799
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Filing Dt:
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11/25/2014
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Publication #:
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Pub Dt:
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05/28/2015
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Inventor:
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Jing-En LUAN
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Title:
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LEADLESS SURFACE MOUNT ASSEMBLY PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12 GAO KE ROAD, BAOLONG INDUSTRIAL PARK |
| LONGGANG DISTRICT, GUANGDONG PROVINCE |
| SHENZHEN, CHINA 518116 |
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| DAVID V. CARLSON |
| SEED IP LAW GROUP, 701 5TH AVENUE, #5400 |
| SEATTLE, WA 98104 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4F&B501-B503 & 6F & B701-B702, BLOCK B, TCL R&D TOWER, NO. 6, SOUTHERN NO. 1 ROAD, SOUTH DISTRICT, HI-TECH INDUSTRIAL PARK |
| NANSHAN, SHENZHEN, CHINA 518057 |
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| PATRICK C.R. HOLMES |
| 750 CANYON DRIVE SUITE 300 |
| COPPELL, TX 75019 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DU CHAMP-DES-FILLES 39 |
| 1228 PLAN-LES-OUATES |
| GENEVA, SWITZERLAND |
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| STMICROELECTRONICS, INC. |
| 750 CANYON DRIVE |
| SUITE 300 |
| COPPELL, TX 75019 |
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