Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/10/2015
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Application #:
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14521609
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Filing Dt:
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10/23/2014
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Publication #:
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Pub Dt:
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04/30/2015
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Inventor:
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Toshihisa YAMAMOTO
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Title:
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SEMICONDUCTOR PACKAGE AND WIRING BOARD HAVING THE SEMICONDUCTOR PACKAGE THEREON
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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| RAYMOND Y. MAH |
| NIXON & VANDERHYE, PC |
| 901 NORTH GLEBE ROAD, 11TH FLOOR |
| ARLINGTON, VA 22203 |
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