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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/24/2015
Application #:
13845728
Filing Dt:
03/18/2013
Publication #:
Pub Dt:
10/31/2013
Inventors:
Yu-Lin Yen, Hsi-Chien Lin, Yeh-Shih Ho
Title:
STACKED WAFER STRUCTURE AND METHOD FOR STACKING A WAFER
Assignment: 1
Reel/Frame:
030031/0896Recorded: 03/18/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/26/2012
Exec Dt:
12/26/2012
Exec Dt:
12/26/2012
Assignee:
9F, NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK
JHONGLI CITY, TAOYUAN COUNTY, TAIWAN
Correspondent:
EDWARDS WILDMAN PALMER LLP
P.O. BOX 55874
BOSTON, MA 02205

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