Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/01/2015
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Application #:
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14254764
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Filing Dt:
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04/16/2014
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Publication #:
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Pub Dt:
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10/22/2015
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Inventors:
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Daeik Daniel Kim, Mario Francisco Velez, Jonghae Kim, Matthew Michael Nowak et al
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Title:
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DIE PACKAGE COMPRISING DIE-TO-WIRE CONNECTOR AND A WIRE-TO-DIE CONNECTOR CONFIGURED TO COUPLE TO A DIE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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| LOZA & LOZA, LLP/QUALCOMM |
| 305 N. SECOND AVE., #127 |
| UPLAND, CA 91786 |
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