Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/01/2015
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Application #:
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14261793
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Filing Dt:
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04/25/2014
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Publication #:
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Pub Dt:
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10/29/2015
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Inventors:
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SHAO-CHI YU, CHIA-MING HUNG, HSIANG-FU CHEN, WEN-CHUAN TAI, HSIN-TING HUANG
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Title:
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STRUCTURE AND METHOD OF PROVIDING A RE-DISTRIBUTION LAYER (RDL) AND A THROUGH-SILICON VIA (TSV)
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN ROAD, VI |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN |
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JONES DAY |
222 EAST 41ST ST |
NEW YORK, NY 10017 |
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