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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
12/08/2015
Application #:
14267552
Filing Dt:
05/01/2014
Publication #:
Pub Dt:
08/28/2014
Inventors:
My Nhu Nguyen, Jason Brandi
Title:
ELECTRONIC DEVICES ASSEMBLED WITH THERMALLY INSULATING LAYERS
Assignment: 1
Reel/Frame:
032837/0416Recorded: 05/07/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/16/2012
Exec Dt:
07/16/2012
Assignee:
ONE HENKEL WAY
ROCKY HILL, CONNECTICUT 06067
Correspondent:
HENKEL CORPORATION
ONE HENKEL WAY
ROCKY HILL, CT 06067
Assignment: 2
Reel/Frame:
035049/0904Recorded: 02/27/2015Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/27/2015
Assignee:
ONE HENKEL WAY
ROCKY HILL, CONNECTICUT 06067
Correspondent:
HENKEL CORPORATION
ONE HENKEL WAY
ROCKY HILL, CT 06067
Assignment: 3
Reel/Frame:
035050/0378Recorded: 02/27/2015Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/27/2015
Assignee:
HENKELSTRASSE 67
DUESSELDORF, GERMANY 40589
Correspondent:
HENKEL CORPORATION
ONE HENKEL WAY
ROCKY HILL, CT 06067

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