Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/08/2015
|
Application #:
|
13715124
|
Filing Dt:
|
12/14/2012
|
|
Publication #:
|
|
Pub Dt:
|
06/20/2013
| | | | |
|
Inventors:
|
Hoojeong Lee, Byunghoon Lee
|
|
Title:
|
BUMP INCLUDING DIFFUSION BARRIER BI-LAYER AND MANUFACTURING METHOD THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| SUNGKYUNKWAN UNIV. (CHEONCHEON-DONG), 2066, SEOBU-RO, JANGAN-GU, SUWON-SI, GYEONGGI-DO, 440-746 |
| SUWON-SI, KOREA, REPUBLIC OF |
|
|
|
|
| NSIP LAW |
| P.O. BOX 65745 |
| WASHINGTON, DC 20035 |
|
|
Search Results as of:
05/08/2024 10:49 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
