Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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14508989
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Filing Dt:
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10/07/2014
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Publication #:
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Pub Dt:
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04/09/2015
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Inventors:
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Chuan-Jin SHIU, Tsang-Yu LIU, Chih-Wei HO, Shih-Hsing CHAN, Ching-Jui CHUANG
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Title:
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METHOD OF FABRICATING WAFER-LEVEL CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9F., NO. 23, JILIN RD. |
| ZHONGLI CITY, TAOYUAN COUNTY, TAIWAN 320 |
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| WEN LIU |
| 350 S. FIGUEROA STREET, SUITE 975 |
| LOS ANGELES, CA 90071 |
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