Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/19/2016
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Application #:
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13626538
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Filing Dt:
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09/25/2012
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Publication #:
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Pub Dt:
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01/24/2013
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Inventors:
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Erik Jan Marinissen, Jacobus Verbree, Mario Konijnenburg, Chun-Chuan Chi
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Title:
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TEST ACCESS ARCHITECTURE FOR TSV-BASED 3D STACKED ICS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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| HIGH TECH CAMPUS 31 |
| EINDHOVEN, NETHERLANDS 5656AE |
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| KNOBBE MARTENS OLSON & BEAR LLP |
| 14TH FLOOPR |
| 2040 MAIN STREET |
| IRVINE, CA 92614 |
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