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Patent Assignment Abstract of Title
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Total Assignments: 4
Patent #:
Issue Dt:
02/02/2016
Application #:
13235782
Filing Dt:
09/19/2011
Publication #:
Pub Dt:
04/05/2012
Inventor:
Kazuyoshi ARAI
Title:
SEMICONDUCTOR DEVICE HAVING MULTILAYER WIRING STRUCTURE AND MANUFACTURING METHOD OF THE SAME
Assignment: 1
Reel/Frame:
026926/0843Recorded: 09/19/2011Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/01/2011
Assignee:
6-2, HONMACHI 1-CHOME, SHIBUYA-KU,
TOKYO, JAPAN 151-8543
Correspondent:
HOLTZ, HOLTZ, GOODMAN & CHICK PC
220 FIFTH AVENUE
16TH FLOOR
NEW YORK, NY 10001-7708
Assignment: 2
Reel/Frame:
027342/0990Recorded: 12/07/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/15/2011
Assignee:
10-6, IMAI 3-CHOME, OME-SHI,
TOKYO,, JAPAN 198-8555
Correspondent:
LEONARD HOLTZ
220 FIFTH AVENUE
16TH FLOOR
NEW YORK, NY 10001
Assignment: 3
Reel/Frame:
031785/0291Recorded: 12/16/2013Pages: 31
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/01/2013
Assignee:
2-7-17, SHIN-YOKOHAMA, KOHOKU-KU,
YOKOHAMA, KANAGAWA, JAPAN 222--0033
Correspondent:
LEONARD HOLTZ
220 FIFTH AVENUE
16TH FLOOR
NEW YORK, NY 10001-7708
Assignment: 4
Reel/Frame:
040371/0554Recorded: 11/18/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/11/2016
Assignee:
455-1, KOHZAI-MINAMIMACHI
TAKAMATSU-SHI
KAGAWA, JAPAN 761-8014
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 828
BRYANT E. WADE
BLOOMFIELD HILLS, MI 48303

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