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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/09/2016
Application #:
14450414
Filing Dt:
08/04/2014
Publication #:
Pub Dt:
02/04/2016
Inventors:
CHEN-LUN HSING CHEN, FENG-CHUAN TSAI, JUNG-HAO HUNG
Title:
PACKAGE STRUCTURE OF LIGHT-EMITTING DIODE MODULE AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
033454/0458Recorded: 08/04/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/28/2014
Exec Dt:
05/28/2014
Exec Dt:
05/28/2014
Assignee:
NO. 89, XIYUAN RD.
ZHONGLI CITY, TAOYUAN COUNTY, TAIWAN
Correspondent:
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE, SUITE 101
ELLICOTT CITY, MD 21043

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