Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/23/2016
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Application #:
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14521342
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Filing Dt:
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10/22/2014
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Inventors:
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I-Chia LIN, Chieh-Chen FU, Kuo-Hsien LIAO, Cheng-Nan LIN
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Title:
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SEMICONDUCTOR DEVICE PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOSIUNG, TAIWAN |
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| FOLEY & LARDNER |
| 3000 K STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007 |
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