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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/01/2016
Application #:
14161744
Filing Dt:
01/23/2014
Publication #:
Pub Dt:
07/24/2014
Inventors:
Shigenobu Maeda, Tsukasa Matsuda, Hidenobu Fukutome
Title:
Semiconductor Device and Fabricating Method Thereof
Assignment: 1
Reel/Frame:
032025/0328Recorded: 01/23/2014Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/20/2013
Exec Dt:
12/06/2013
Exec Dt:
01/13/2014
Assignee:
129, SAMSUNG-RO
YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742
Correspondent:
MICHELE P. MCMAHAN
4140 PARKLAKE AVENUE
RALEIGH, NC 27612

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