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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/08/2016
Application #:
14613175
Filing Dt:
02/03/2015
Publication #:
Pub Dt:
08/06/2015
Inventors:
Shigeki KONDO, Takahiro ROPPONGI, Isamu SATO, Hiroyoshi KAWASAKI, Atsushi IKEDA et al
Title:
CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND SOLDER JOINT
Assignment: 1
Reel/Frame:
034880/0034Recorded: 02/03/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/26/2015
Exec Dt:
01/26/2015
Exec Dt:
01/26/2015
Exec Dt:
01/26/2015
Exec Dt:
01/26/2015
Exec Dt:
01/26/2015
Assignee:
23, SENJU-HASHIDO-CHO, ADACHI-KU
TOKYO, JAPAN 120-8555
Correspondent:
DONALD B. HASLETT
601 SW SECOND AVENUE
SUITE 1600
PORTLAND, OR 97204-3157
Assignment: 2
Reel/Frame:
035294/0175Recorded: 03/25/2015Pages: 4
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME PREVIOUSLY RECORDED AT REEL: 034880 FRAME: 0034. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
01/26/2015
Exec Dt:
01/26/2015
Exec Dt:
01/26/2015
Exec Dt:
01/26/2015
Exec Dt:
01/26/2015
Exec Dt:
01/26/2015
Assignee:
23, SENJU-HASHIDO-CHO, ADACHI-KU
TOKYO, JAPAN 120-8555
Correspondent:
DONALD B. HASLETT
601 SW SECOND AVENUE
SUITE 1600
PORTLAND, OR 97204

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