Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/08/2016
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Application #:
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13524141
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Filing Dt:
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06/15/2012
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Publication #:
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Pub Dt:
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12/19/2013
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Inventors:
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Mark Sheplak, Dylan Paul Alexander, Tiffany Nichole Reagan, Jessica Caitlin Meloy et al
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Title:
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Micro-Sensor Package And Associated Method Of Assembling The Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100 N RIVERSIDE |
| CHICAGO, ILLINOIS 60606-2016 |
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| SMITH MOORE LEATHERWOOD - BOEING |
| 300 NORTH GREENE STREET |
| SUITE 1400 |
| GREENSBORO, NC 27401 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 223 GRINTER HALL, UNIVERSITY OF FLORIDA |
| P.O. BOX 115500 |
| GAINESVILLE, FLORIDA 32611-5500 |
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| WOMBLE CARLYLE SANDRIDGE & RICE LLP |
| ATTN: IP DOCKETING |
| P.O. BOX 7037 |
| ATLANTA, GA 30357-0037 |
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