Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/15/2016
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Application #:
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13872632
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Filing Dt:
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04/29/2013
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Publication #:
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Pub Dt:
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10/30/2014
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Inventors:
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Chien-Hua Chen, Kianush Naeli, Stephen R. Farrar
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Title:
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MULTI-WAFER PAIR ANODIC BONDING APPARATUS AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11445 COMPAQ CENTER DRIVE WEST |
| HOUSTON, TEXAS 77070 |
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| HEWLETT-PACKARD COMPANY |
| 3404 E. HARMONY ROAD MS 35 |
| INTELLECTUAL PROPERTY ADMINISTRATION |
| FORT COLLINS, CO 80528 |
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