Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/29/2016
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Application #:
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12844113
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Filing Dt:
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07/27/2010
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Publication #:
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Pub Dt:
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02/02/2012
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Inventors:
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Yu-Liang LIN, Weng-Jin WU, Jing-Cheng LIN
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Title:
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SUBSTRATE BONDING SYSTEM AND METHOD OF MODIFYING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| LOWE HAUPTMAN HAM & BERNER, LLP (TSMC) |
| 1700 DIAGONAL ROAD, SUITE 300 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BAYERWERK, Q18 |
| LEVERKUSEN, GERMANY 51368 |
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| KATHARINE E. MCELHONE, PH.D. |
| MORRISON & FOERSTER LLP |
| 12531 HIGH BLUFF DRIVE, SUITE 100 |
| SAN DIEGO, CA 92130 |
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