Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/05/2016
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Application #:
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14210718
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Filing Dt:
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03/14/2014
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Publication #:
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Pub Dt:
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07/02/2015
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Inventors:
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Ting-Ting Hwang, Fu-Wei Chen
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Title:
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Apparatus of Three-Dimensional Integrated-Circuit Chip Using Fault-Tolerant Test Through-Silicon-Via
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.101, SEC. 2, GUANGFU RD. |
| EAST DIST. |
| HSINCHU CITY, TAIWAN 300 |
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| JACKSON INTELLECTUAL PROPERTY GROUP PLLC |
| 106 STARVALE LANE |
| SHIPMAN, VA 22971 |
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